An Efficient Micro-Bolometer Design for Temperature Measurement

The article describes the design of a micro-bolometer for temperature measurement applications. The design of micro-bolometer includes material selection for chip, packaging, and substrate, and micromachining process for micro-bolometer fabrication and wafer-level hermetic sealing processes for packaging. The packaging of micro-bolometer plays a crucial role in its performance, so it was given importance while designing. Wafer-to-wafer bonding was applied in order to provide hermetic sealing-based packaging. Solidworks was used for solid modeling.