Numerical Study on Heat Transfer Through Semi-Circular Grooved Microchannel

The study of heat transfer characteristics in a microchannel is very important in the context of enhancing heat transfer in electronic cooling applications. In the present study, the heated surface of the microchannel is provided with semi-circular grooves or dimples to enhance the cooling capacity in heat sinks. Numerical simulations were performed to quantify the heat transfer enhancement and the corresponding increase in pressure drop in a microchannel with and without the circular grooves. The influence of the Reynolds number (Re), i.e. the inlet coolant velocity on the heat transfer characteristics in the microchannel is investigated. It was noticed that for lower Re, the presence of dimples is deteriorating the heat transfer rates further, whereas, for higher Re, the heat transfer enhancement is noticed for the microchannel with dimples by 2.273%.