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Effects of Temperature on the Dynamic Analysis of Multi-layer Mindlin Plates Subjected to Moving Loads

  • Thai-Binh Nguyen,
  • Hoang Tri Hua,
  • Van Hai Luong

摘要

The objective of this study is to examine the impact of temperature on the dynamic response of a multi-layer Mindlin plate resting on a Pasternak foundation. The investigation encompasses various scenarios involving changes in plate thickness, connecting layer properties, and moving load velocity. The governing equations of motion are derived using the principle of virtual work, accounting for temperature effects. Subsequently, these equations are transformed into the moving coordinate system and discretized through the multi-layer plate element method (MMPM). The resulting system of equations is assembled using standard procedures and solved using Newmark’s β method. The findings unveil distinct trends dependent on the parameters under scrutiny. Notably, temperature exerts a significant impact on dynamic behavior when adjusting plate thickness. Conversely, temperature's influence remains limited when altering connecting layer properties. Furthermore, the dynamic responses of maximum displacements for both upper and lower plates remain consistent despite temperature variations when the velocity of the moving load is modified. These outcomes collectively contribute to a comprehensive understanding of the intricate interplay between temperature and dynamic behavior of the considered multi-layer Mindlin plate.