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Effect of Microstructures in the Flow Passage on the Flow Dynamics of Microchannel

  • A. Rajalingam,
  • Shubhankar Chakraborty

摘要

The microchannels serve as a heat dissipation device in the miniaturized—high performance electronic components. The incorporation of microstructures in the flow passage of microchannel helps to increase the rate of heat dissipation due to the flow interruption, acceleration, increase of heat transfer surface area, boundary layer deformation, etc. However, the flow dynamics is the integrated part of the heat transfer. This manuscript deals with the effect of various arrangements and cross-sections of microstructure in the flow field. The pressure drop increases as the microstructure splits and the space between the split microstructure increases. The cross-section and velocity of fluid flow influence the skin friction coefficient on the surface of the microstructure. The trend of variation of pressure drop and drag coefficient is almost the same.