3D Stacked IC Chip Design: From CMOS to 2D Materials

The constant demand for higher performance and increased functionality in electronic devices has driven the evolution of integrated circuit (IC) chip design. Traditional CMOS technology has played a pivotal role in meeting these requirements, but as the limitations of planar CMOS chips become more apparent, alternative design approaches are being explored. This paper delves into the concept of 3D stacked IC chip design, which offers significant advantages over planar chips, and examines the transition from CMOS technology to the utilization of 2D materials. The abstract provides a comprehensive overview of the key concepts, challenges, advantages, and future prospects associated with 3D stacked IC chip design, emphasizing the incorporation of 2D materials as a promising avenue for further advancements.