Low-k Dielectric for Semiconductor Packaging: Advancements, Challenges, and Future Outlook
摘要
This chapter examines the significance of low-k dielectric materials in semiconductor packaging. Low-k dielectrics play a critical role in reducing parasitic capacitance, improving signal integrity, and enhancing electrical performance in advanced semiconductor devices. The chapter explores the advancements in low-k dielectric materials, fabrication techniques, integration challenges, and the impact on device performance. It also discusses the future outlook for low-k dielectric technologies and their potential applications in various industries.