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Numerical Study on Heat Transfer Through In-Phase, Out-Phase and Straight Microchannel

  • Zahoor Bhat,
  • Yogesh M. Nimdeo,
  • Harish Pothukuchi,
  • Divya Haridas

摘要

Thermal cooling is very important for the smooth functioning of electronic devices. The simulations were performed to obtain the pressure, velocity and temperature distributions for different flow conditions. Further, the surface Nusselt number is calculated to estimate and compare the thermal performance of straight and wavy microchannels. Water is used as a cooling medium and the inlet Reynolds number varies from 50–600 by varying the coolant inlet velocity. It was observed that as compared to the straight channel, in-phase and out-phase channel shows 49.53% and 45% enhancement in heat transfer, respectively. The comparison is made on the basis of the average Nusselt number obtained at Re = 300. However, the lower pressure drop is obtained in a straight channel followed by in-phase and out-phase wavy channels, respectively.