Modelling and Analysis of Copper and Carbon Nanotube VLSI Interconnects

In this chapter, a numerical inverse Laplace Transform-based model is presented to estimate the delay and crosstalk noise of Copper (Cu) and Carbon Nanotube (CNT) interconnects. The proposed model is formulated on the Gaver-Stehfest method, which provides a relation between the time domain function and linear combination of the transfer function values. The values of delay and overshoot in single Cu and CNT lines are estimated for different line lengths, load capacitance and source resistances. The proposed model is utilized to calculate crosstalk delay, peak noise voltage and timing instance of peak voltage. All the estimated parameters are compared with the existing Padé model and SPICE and are found to be in good agreement. The 50% delay, overshoot and crosstalk results of Cu interconnects match to SPICE results with 0.37%, 0.65% and 0.58%, respectively. In CNT interconnects, the average error of 50% delay, overshoot and crosstalk of the proposed model are 1.2%, 0.06% and 0.22%, respectively.