New Technology in Integration and Interconnection

Three-dimensional (3D) integration is a new integration technology that vertically stacks many layers of chips and electrically connects the layers using through-silicon-vias (TSVs), improving the chip integration density and reducing the power consumption. 3D integration has been emerging as a key technology for integrated circuit (IC) industry and received great attentions. TSVs process technology is used to form the 3D integrated structures. On-chip optical interconnect is developed to achieve data transmission on a large-scale IC chip with the photonic integrated circuit, aiming to break the capacity bottleneck of the current copper-based interconnection technology. This chapter introduces the fabrication process, structure, and main advantages of TSVs, 3D integration, and on-chip optical interconnect technology. The future develop trends of these technologies are also addressed.