Packaging and Assembly Equipment

With the development of advanced packaging technology, More-than-Moore device has pushed the IC packaging to a more important status. Electronic packaging is the back-end process in the chip manufacturing, and the equipment plays an important role in the yield of packaging. The market share of plug-in packages such as dual in-line package (DIP) has gradually shrunk, while packages such as flip-chip, fan-out, wafer-level package (WLP), system in package (SiP), and three-dimensional package (3D) are gradually becoming the mainstream. Bumping, TSV, RDL, and other advanced processes are promoted, new packaging equipment are constantly being proposed and upgraded. Many front-end chip manufacturing equipment are used for the back-end packaging, and there are many special equipment for new processes, such as temporary bonding/unbonding machine and wafer bonding machine for ultrathin wafer processing. This chapter introduces the structure, performance, and application of traditional packaging equipment, and discusses the special equipment used in advanced packaging.