Integrated Circuits Packaging Reliability

Package reliability is a very important aspect for IC products and is studied for the improvement and optimization of package design, processes, and materials, etc., as well as the development of measurement, test method, and applications. The state-of-the-art reliability theory, mechanisms, and failure analysis (FA) methods are urged to analyze, simulate, evaluate, and improve IC reliability, achieving more accurate prediction of the product lifetime. This chapter mainly describes the definition, design, testing procedures, and standards for the reliability of IC packaging. In addition, the methods and procedures of FA are also introduced.