Design Technologies for Advanced Packaging

With the trend of electronic products toward multifunctions, miniaturization, and high performance, the advanced packaging and system-on-chip technologies are the main methods to achieve higher added value products. In order to ensure product performance, design technologies become increasingly more important. This chapter summarizes and discusses the key points of design technologies for advanced packaging. According to the performance requirements, different package types and material systems should be selected. Electrical, thermal, and structural designs, even multiphysics analysis, and necessary collaborative designs are needed.