Key Technologies and Processes for Traditional Packaging

Today, traditional packaging technologies still play important roles for most of the ICs, MEMS, and sensors due to the advantages of low cost, good reliability, and huge production capacity. Continuous innovations of these technologies are driven by new applications such as 5G, automotive, IoT applications, etc. In this chapter, the main processes of traditional packaging such as wafer thinning, wafer dicing, die-attach, wire bonding, molding, plating are introduced. Then the structures, processes, developing trend, and applications for several typical traditional packaging technologies, i.e., SOP (small outline package), QFN (Quad flat no-lead package), WB-BGA (wire bond ball grid array), Metal Packaging, and Ceramic Packaging are explained and discussed.