Integrated Circuit Package Types

This chapter describes the main types of packages and the evolution of package technologies of integrated circuits. Firstly, the definition and function of conventional packages are described, and the concept of advanced package is explained. After that, main packaging technologies such as quad flat packaging (QFP), system-in-package (SiP), wafer-level packaging (WLP) and three-dimensional (3D) packaging, microsystem packaging, multi-chip module, and embedded packaging are presented. Then, the classification and properties of packages that depend on materials, interconnects, and hermeticity are introduced. Finally, the selection of packaging types in the application is illustrated and discussed.