The core component of power converters, IGBT, typically operates in various complex environmental couplings. In order to more effectively utilize IGBT modules, this paper establishes a finite element simulation model of electric-thermal-mechanical coupling to study the distribution of electric field, temperature, and stress after continuous electrical and thermal damage during the operation of IGBT modules, in order to explore their aging characteristics. In a vibrational environment, the introduction of mechanical stress exacerbates the extent of damage to IGBT modules, which may lead to the accelerated expansion of solder layer cracks and bond wire fractures, ultimately speeding up the module's failure rate and reducing its service life.