Investigation of Pool Boiling Heat Transfer on Modified Copper and Aluminum Surfaces
摘要
This paper investigates pool-boiling heat transfer using surface modification, examining smooth and rough pin-finned surfaces on copper and aluminum. The study visualizes bubble formation and departure diameter, aiming to predict heat transfer coefficients (HTC) under different heat fluxes (HF). Four surfaces were tested: smooth copper, pin-fin copper, smooth aluminum, and rough pin-finned aluminum. Results reveal differences in bubble characteristics and formation/departure times between smooth and rough surfaces. For example, on smooth copper, bubble diameter sizes (low, medium, and CHF) were 0.2803 cm, 0.437 cm, and 0.67 cm, with corresponding formation and departure times of 0.2859 s, 0.305 s, and 0.4025 s. Pin-finned copper surfaces exhibited larger diameters (0.745 cm, 1.38 cm, 1.95 cm) and shorter times (0.184 s, 0.207 s, 0.417 s). Smooth aluminum surface had diameters (0.63 cm, 0.96 cm, 1.27 cm) and times (0.27s, 0.36s, 0.40s), while pin-finned aluminum showed sizes (0.24 cm, 0.30 cm, 0.83 cm) and times (0.11 s, 0.13 s, 0.21 s). The study concludes that rough pin-finned copper enhances boiling HTC and HF at lower wall superheat temperatures compared to the smooth surface. Keywords: Pool boiling, heat transfer, bubble dynamics, critical heat flux.