Laser Triangulation-Based Profilometer to Measure the Warpage During Fabrication
摘要
The importance of additive manufacturing and usage of fused deposition modelling (FDM) is increasing day by day because FDM is a cost-effective and easy-to-use technique. Objects get deformed during printing or post-printing, and this is due to the thermal properties of the material and huge variation between nozzle temperature and ambient temperature. This distortion and deformation of objects is due to warpage and shrinkage. Shrinkage in printed objects occurs due to lowering the specific volume from the liquid phase to a solid phase. On the other hand, warpage is due to internal stress within the printed object because of uneven heat distribution. The techniques to measure warpage post-printing can be of contact type or noncontact type. In this paper, a surface profilometer based on laser triangulation, which is a well-known noncontact-type method, is used to measure the warpage. Simulations are performed in different types of noise conditions and for different-sized templates on multiple 3D objects created using Python. The root-mean-square error (RMSE) obtained after simulation is used to get the optimised set of parameters to be used for the experimental reconstruction. An industrial camera with 1280 × 1024 resolution is used to capture the images of deformed line laser profile on the object which are processed using OpenCV library of Python. Digital image correlation (DIC) technique is used to find the similarity between the reference and distorted images by calculating the normalised cross-correlation (NCC). Sub-pixel shift estimation algorithm has been utilised to get the disparity at sub-pixel level. The paper presents the work on the algorithm developed to do the sub-pixel shift and get the accurate height maps. The results corresponding to different similarity functions are also compared in the paper. The proposed method can find the height map of 3D objects with accuracy in the range of a few microns. The developed method has the capability to find the maximum height of about 27 mm, with resolution 43 microns per pixel, when the field of view is 87.5 mm × 70 mm. The root-mean-square error obtained after experiment was found to be 3.23 microns. The processing time it takes is about 0.2 s per image and has the potential to measure the warpage while it is in the fabrication process.