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With improvement in processors and other electrical components in laptops, the need for better cooling is increasing. Current solutions for CPU cooling opt for liquid cooling over traditional fans. Upcoming CPU upgrades are said to follow the trend of having higher heat generation. This paper proposes a liquid cooling system optimized for future generation of CPUs by simulation in Ansys Fluent. This paper compares the effectiveness of aluminium oxide and copper oxide nanofluids being used as coolants compared to water in PC liquid cooling systems but the volume fraction of the nanofluids is taken as 4% as the calculations were only able to give properties for the specific volume fraction. The comparisons were made at various flow rates. \({\text{CuO}}\) had the most heat transfer rate with an average increase of 93.49% w.r.t heat transfer rate in case of water.

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Design Optimization of Liquid Cooled Cold Plate Using Nanoparticle Fluid

  • 会议论文

  • 发表日期：

    2025年

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  • Aryan Koshatwar,
  • Atharva Paygude,
  • Atharva Patil,
  • Atharva Chippa,
  • Atharva Bande,
  • Mangesh Chaudhari

摘要

With improvement in processors and other electrical components in laptops, the need for better cooling is increasing. Current solutions for CPU cooling opt for liquid cooling over traditional fans. Upcoming CPU upgrades are said to follow the trend of having higher heat generation. This paper proposes a liquid cooling system optimized for future generation of CPUs by simulation in Ansys Fluent. This paper compares the effectiveness of aluminium oxide and copper oxide nanofluids being used as coolants compared to water in PC liquid cooling systems but the volume fraction of the nanofluids is taken as 4% as the calculations were only able to give properties for the specific volume fraction. The comparisons were made at various flow rates. \({\text{CuO}}\) had the most heat transfer rate with an average increase of 93.49% w.r.t heat transfer rate in case of water.