Thermal Simulation Analysis of a Certain Electronic Device in High-Altitude Parachute Opening Test
摘要
This critical equipment undergoes complex external environments such as ground launch, high-altitude flight, and start-up work, making it difficult to low-cost verify its ability to withstand external environments through ground testing. In response to this situation, this article uses theoretical methods to analyze the main paths of heat transfer, and then establishes a mathematical simulation model to analyze the factors affecting the temperature of a certain electronic device. Finally, the results are verified with experimental data, and the simulation results are consistent with the experimental data. It can provide a reference for the thermal design of a certain electronic device for high-altitude parachute deployment in the future.