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Study on Temperature Uniformity of Spacecraft Component-Level Thermal Vacuum Tests

  • Xiaohan Wang,
  • Wei Guo,
  • Tengfei Ma,
  • Shupeng Li,
  • Zhiwei Lyu,
  • Xinming Su

摘要

Temperature uniformity is a critical technical parameter in thermal vacuum testing. This study involves creating a geometric model of small-scale mixed refrigerant vacuum test equipment (SMRVTE) and using the steady-state thermal analysis module in Ansys Workbench to simulate temperature fields of various test products under different conditions. Concurrently, thermal vacuum tests were conducted under conditions identical to those in the simulation. The analysis revealed that the presence of heat sink openings adversely affects product temperature uniformity. Introducing copper plates coated with black paint to block the heat sink openings was found to enhance temperature uniformity during both heating and cooling processes. Based on these findings, recommendations are provided for conducting thermal vacuum tests using SMRVTE.