Currently, resin 3D printing technology is being applied in many different important industrial fields with great potential. However, the process of designing and manufacturing products using this technology still has some issues that need to be researched and perfected, such as the phenomenon of weak bonds in the product structure. This phenomenon will cause damage to the manufactured part or reduce mechanical properties due to adhesion and the ability of the material layers to bond together. The article proposes a method using the Topology optimization module of Ansys software to simulate and eliminate weak bonds through stress constraints to prevent damage during the manufacturing process. The simulation process shows that, on the MBB (Messerschmitt-Bolkow-Blohm) beam model, a mass limit of 50% will give a model with a reasonable structure. At the same time, the stress constraint at a value of 2 MPa will eliminate weak connection locations in the structure of the test model. The results of the research help improve manufacturing capabilities and improve the durability of resin 3D printed products.