Condition Monitoring for IGBT Power Module

In this paper, a non-contact monitoring method based on magnetic field induction is proposed. Firstly, the failure process and of bonding wire lifting off is analyzed and simulated by finite element simulation. Secondly, the switching process of IGBT is explained, the change rate of current di/dt in the rising and falling stages is analyzed, Then, a model of the magnetic field around a single wire is established, and the changes in the surrounding magnetic field under the failure of bonding wire lifting off are analyzed and simulated, the relationship between the condition of bonding wire and the magnetic field intensity is established.