Failure Analysis of Conductive Adhesive Interconnection Between Connector and Antenna Unit

Conductive adhesive was widely used in electronic packaging technology due to its advantages of good conductivity, flexible process, simple operation, and low cost. The connector and antenna unit were bonded and interconnected with conductive adhesive (H20E). After the installation of the antenna array, multiple rounds of screening and environmental testing were conducted. After each round of testing, there was interconnection failure phenomenon between connector and antenna unit. Targeting to resolve the problem of the conductive adhesive interconnection between connector and antenna unit, the failure mechanism of conductive adhesive was analyzed through from three aspects: high power use, environmental stress and mechanical stress before implemented simulation and experimental verification. Based on the simulation and experimental array test results, the problem of interconnection failure between connectors and antenna units had been fundamentally solved by strictly controlling the gap between connector pins and antenna unit sockets from root. The improvement of interconnection between the connector and antenna unit was significant and met the design specifications. And the improvement effect is significant. This paper provided the useful references for improving the reliability of this type of interconnection form in engineering applications.