Application of Laser in Cleaning Electronic Components

In the manufacturing of electronic circuit boards, tiny particles and other contaminants that adhere to the board during etching, deposition, and plating processes can greatly reduce electronic efficiency and even cause damage to components. These attached particles include tiny particles of silicon, silica, alumina, and polystyrene produced during the manufacturing process. These tiny particles can cause short circuits or significant performance degradation in large-scale integrated circuits and micro high-density storage devices, leading to fatal damage such as scratches or cracks on the surface of micro-mechanical devices.