Development of High Thermal Conductive Insulation System

Conventional insulation materials have a low thermal conductivity and are thermally insulating. The miniaturization and increased power of electrical devices would produce a lot of heat, posing new difficulties for the grid’s safe and stable operation. A novel approach to addressing these issues is the development of insulating materials with high thermal conductivity. Enhancing thermal conductivity would increase the electrical equipment’s capacity to conduct heat and significantly lower its operating temperature, which could result in smaller, longer-lasting electrical equipment. Over the last century, there has been a rapid growth in the electrical industry, creating a demand for engineered materials that can enhance the performance of newly innovated electrical products. Introducing particle fillers (alumina, silica, titania, and boron nitride) to polymer parts has been around for many years, often for increases in strength or weight reduction. Demand for these composite parts has grown to maintain strength and introduce new capabilities such as thermal conductivity and electrical resistivity. Electrical equipment’s performance metrics can be increased using specific fillers without requiring design changes.