On the Performance of Destructive Bond Strength Tests in Wedge Welding Stability
摘要
Bond strength tests are the most widely accepted methods for controlling the quality of the wire bonding operation, and thereby offering added assurance that semiconductor devices will not fail in the field due to weak wire bonds. In this paper, three destructive bond strength tests are investigated in Au/Al and Al/Al bonding interface. Experiments demonstrate that wire bond shear test and wire pull test (single bond) can reflect the bonding state of the Au/Al interface more accurately than wire pull test (double bond). To obtain the most reliable data, combining wire bond shear test and its wedge bond lift offs records would be the best choice for Au/Al interface stability.