Assessment of Grinding Quality Under Different Environment Using Image Processing Tool

Grinding is an abrasive machining process by which work material is removed in the form of microchip by a wheel bonded with hard abrasive grains. In the present work, parametric optimization has been done in grinding by varying grinding parameters under different environmental conditions using image processing tool to detect saw-toothed edges of chip and smooth distinct lay mark on ground surface. It is done by counting total number of pixels present on image of workpiece surface, i.e. discontinuity in plane (edge). This optimization technique helps to find out the best grinding quality in a particular experimental condition. It is observed that the desired grinding quality with reasonably good accuracy under different environment and proper machining condition can be assessed using an image processing tool.