During the machining of titanium alloys, high temperatures are generated in the cutting area due to deformation of the material and friction of the chips along the tool surface, which adversely affects the cutting tool and leads to a decrease in machining quality. Therefore, it is critical to monitor cutting temperatures in the cutting process. To improve the sensor lifetime and temperature measurement accuracy, thermoelectric simulations are performed using simulation software to derive the structural dimensions for conjugate multipoint temperature measurement of thin-film thermocouples. The SiO2, NiSi, and NiCr films were sequentially sputtered onto the PCBN tool using the DC pulsed magnetron sputtering technique. The films’ microstructure was subsequently analyzed. Using the calibration system to test and analyze the static and dynamic characteristics of the developed temperature measuring tool, the results show that the developed temperature measuring tool has good linearity in the range of 30–420 °C, with an average Seebeck coefficient of 41.3 μV/°C, a linearity error of less than 0.87%, a maximum repeatability error of 2.113%, and a fast dynamic response.

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Development and Performance of Conjugate Multi-point Temperature Measurement Tool Based on Thin-Film Thermocouple

  • Junwei Yin,
  • Jiaxin Wu,
  • Hang Liu,
  • Yuang Li,
  • Yunxian Cui

摘要

During the machining of titanium alloys, high temperatures are generated in the cutting area due to deformation of the material and friction of the chips along the tool surface, which adversely affects the cutting tool and leads to a decrease in machining quality. Therefore, it is critical to monitor cutting temperatures in the cutting process. To improve the sensor lifetime and temperature measurement accuracy, thermoelectric simulations are performed using simulation software to derive the structural dimensions for conjugate multipoint temperature measurement of thin-film thermocouples. The SiO2, NiSi, and NiCr films were sequentially sputtered onto the PCBN tool using the DC pulsed magnetron sputtering technique. The films’ microstructure was subsequently analyzed. Using the calibration system to test and analyze the static and dynamic characteristics of the developed temperature measuring tool, the results show that the developed temperature measuring tool has good linearity in the range of 30–420 °C, with an average Seebeck coefficient of 41.3 μV/°C, a linearity error of less than 0.87%, a maximum repeatability error of 2.113%, and a fast dynamic response.