Research on Simulation of Heat Conduction in the Built-in SF6 Multiparameter Sensor
摘要
This article analyzes the heating model and heat transfer mode of electronic components in SF6 multi-parameter sensors, and conducts simulation research on fluid heat transfer in the two end cavities, no fluid heat transfer in the two end cavities, isolation measures between the sensor and the base, and no fluid heat transfer in the two end cavities. The thermal effects of electronic component heating on temperature, pressure, micro water sensors, and multi-parameter detection are evaluated, Effectively verified the rational layout scheme of the perception unit and the thermal isolation measures of the two end cavities.