Comparative CFD Analysis of Different Shape Microchannel Heat Sinks

As demand for advanced cooling technologies for electronics with high-power IC packages (microchips) grows, the MCHS has become a popular medium for cooling. In this study, different shapes of MCHS have been used to enhance the efficiency of heat transfer at the time of cooling. CFD approach was employed to inspect the effect of the designs of microchannel on the efficiency of heat transfer. For geometric modeling and simulation of the systems, an ANSYS workbench 2022 was employed in the present work. Aluminum alloy with given properties was used as a material for the microchannel’s physical modeling. To achieve heat dissipation and efficiency, the flow, dimension, and surface area of the microchannel were considered, and having a good surface finish, orientation, and size of the microchannel in which a direct impact is produced from the heat sink while heat transfer. By using CFD analysis, pressure, heat transfer rate, static temperature, mass flow rate, friction factor, and wall temperature were evaluated. In conclusion, the use of microchannels has become increasingly popular due to the improved transfer of heat efficiency they provide. Different shapes and designs of MCHS have been developed to increase performance.