Fan-Out Technology

There are eight different topics in this chapter. (1) chip-first with die face-down for heterogeneous integration of 4 chips and 4 capacitors, (2) chip-first with die face-down for heterogeneous integration of mini-LED RGB display, (3) chip-first with die face-up for a large 10 mm × 10 mm chip, (4) pane-level fan-out RDL-first packaging for heterogeneous integration, (5) hybrid substrate with PID by RDL-first panel-level packaging, (6) hybrid substrate with ABF by RDL-first panel-level packaging, (7) hybrid substrate with ultralarge organic interposer for heterogeneous integration, and (8) hybrid substrate with interconnect-layer for heterogeneous integration.