Fan-In Technology

The wafer-level chip-scale package (WLCSP) era began in 2001, when Amkor led the outsourced semiconductor assembly and tests and foundries to license the UltraCSP from Flip Chip Technologies (now Flip Chip International, a subsidiary of Huatian Technology in China). In the past 20+ years, WLCSP have been used extensively for low-cost, low-end, low-profile, low-pin count, small-form factor, and high-volume applications. In this chapter, many examples will be provided and specifically, a six-sided molded panel-level chip-scale package will be presented.