Flip Chip Technology

Flip chip technologies have been used extensively for the processors of mainframe computers, servers, personal computers, notebooks, smartphones, tablets, games, etc., the application specific integrated circuits (ASICs) of networking, telecommunications, etc., and the memories of data storage devices, etc. Most of the flip chip assemblies are mass reflowed. Recently, because of the requirements of higher functionalities of the chips and shrinking the chips’ area, the number of pinout of the processors, ASICs, and memories increases and their pitch decreases. Also, because of the trends of smaller form factors for mobile and portable products, the thickness of the chips and package substrates must be as thin as possible. Higher pin counts, tighter pitches, thinner chips, and thinner package substrates lead to the necessity of the TCB or even the hybrid bonding methods of flip-chip assemblies. In this chapter, besides mass reflow, various TCB techniques are mentioned. A high throughput LPC (liquid phase contactLiquid phase contact) TCB process is mentioned. Hybrid bonding will be discussed in Chap. 2 of this book.