Characterization of Solder Mechanical Properties Based on Nanoindentation
摘要
This article systematically elaborates on the in-situ measurement of solder using nanoindentation technology, and combines numerical inversion methods to analyze its elastic–plastic and creep mechanical properties. The elastic–plastic and creep constitutive equations of solder are constructed, and the influence of temperature on the elastic–plastic and creep characteristic of solder is studied. This provides an effective in-situ measurement and analysis method for characterizing the mechanical properties of high-density micro solder interconnection structures in radar electronic equipment.