Topology Optimization of Thermo-Electric Systems

Thermal management is a big issue in electrical power systems. As the temperature increases, electrical conductivity decreases, leading to joule heating hotspots. These hotspots damage the semiconductor devices, the adhesive material used between conductors and dielectric material. Copper and aluminium are materials generally used in electrical power systems. These are expensive materials. The aim of the present work is optimization at the maximum converter power possible to set the worst-case scenario in which temperatures do not exceed the maximum allowed temperature. An optimal conception must avoid these problems without forgetting that temperatures that are too low are a sign of oversized systems and waste of material. The topology optimization approach is one such approach that can help achieve the objective. This paper uses density-based topology optimization algorithms for the material distribution in electric circuits. Two physics models are used for the thermo-electric analysis: first is an electrical model, and the other is a thermal model. These models are coupled. Heat generated from the electrical power is the heat source in the thermal diffusion equation, and the effect of temperature on electrical resistivity is included using the linear relation.