Optimal Design of Contact Interface Material Hardness for Improving Thermal Contact Performance

The material hardness distribution of the contact interface is the core factor affecting the elastic–plastic contact deformation behavior, and its distribution determines the thermal contact performance. Therefore, this paper proposed a new idea to improve thermal contact performance by designing the hardness distribution of the contact interface. Specifically, a contact interface hardness optimization design algorithm was proposed. In addition, taking electronic chip packaging as the application object, a numerical analysis model of microscopic thermal contact performance was constructed, and the effectiveness of the algorithm was verified. The results showed that after the optimal design, the TCR and CITDN of the electronic chip package were reduced by 83.23 and 36.82%.