Numerical Investigation of Fluid Flow and Heat Transfer in Microchannel Heat Sink with Rectangular Grooves and Sine Wavy Channels

The performance and reliability of electronic systems have been seriously affected by the heating density of semiconductors. The enhancement of the heat transfer improves the thermal rating, and life of the component and also saves energy. A detailed investigation was carried out to investigate the thermos-hydrodynamic properties of a fluid in a microchannel operating under laminar flow regime. The numerical simulations were carried out at different flow rates, and geometrical parameters at constant heat flux 900,000 W/m2 for a range of Reynolds numbers 100 to 400. The obtained results were validated with experimental results and parametric analysis done with different grooves like continuous, bottom, side, and rotating grooves and sine wavy channels of the amplitude of 0.1 and 0.2. The bottom grooves offer less obstruction among all grooved channels and wavy channels. The maximum Nusselt number observed is 10.74 at Reynolds number 400 in connected grooves and the maximum friction factor noticed is 0.391 in sine wavy channel amplitude of 0.2 at Reynolds number 400. The connected grooves gave good results compared to all other cases, with a maximum increase in performance of 60% more than the straight channel at Re = 400.