Comparison of Distributed Coil Connections for Medium and High Distance-to-Diameter Ratio IPT Systems

Large voltage stresses exist on the coupling pads and compensation capacitors in the medium to high distance-to-diameter ratio induction power transmission applications at more significant power levels. The existing solution uses distributed compensation to reduce the voltage stresses on the system components. Most studies have connected the distributed coils in series and have yet to analyze the various connections in detail. However, different ways of connecting distributed compensation coils will result in different output power, output efficiency, and current stresses in each branch within the system. This paper will analyze the characteristics of each of the four distributed coil connections for the S-S compensation topology. It will also discuss the most suitable distributed coil connections for the medium to high distance-to-diameter ratio conditions in wireless power transmission application scenarios at more significant power levels.