Thermal Resistance Measurement Methods for Double-Sided Heat Dissipation IGBTs

With the continuous development of electronic devices and increasing performance requirements, thermal resistance, as one of the important parameters for evaluating the performance and thermal management effectiveness of heat dissipation devices, is crucial for device performance and reliability. For the thermal resistance measurement of single-sided heat dissipation devices, there are mature calculation and measurement methods available. However, for double-sided heat dissipation devices, the existing measurement methods suffer from significant measurement errors and limitations due to structural asymmetry and dual-sided heat flow paths. In this paper, focusing on rigid press-pack IGBTs, the applicability, error sources, and limitations of commonly used theoretical calculation methods, finite element simulation methods, and experimental measurement methods in double-sided thermal resistance measurement are discussed. By comparing the advantages, disadvantages, and applicable ranges of different methods, this study provides references and guidance for double-sided thermal resistance measurement.