Thermal Layout Optimization of Power Devices on PCB

The layout of PCB power devices is a key factor affecting the temperature distribution of power electronics. However, the current targeted optimization methods suffer from large temperature calculation errors and optimization limitations. Therefore, this paper carries out a thermal layout optimization study of PCB power devices based on finite element and genetic algorithm, and verifies it. Firstly, this paper writes a MATLAB finite element program (hereinafter referred to as MFEP) for the initial layout temperature calculation of PCB power devices, and the error is found to be around 0.3% by comparing with the simulation results of ANSYS and the simulation time is reduced by about 71% compared with that of ANSYS. Then the optimization model is established. Finally, This paper uses MFEP and genetic algorithm for PCB power device thermal layout optimization, and ANSYS is used to verify the optimization results, and the maximum junction temperature of the MOSFETs on the PCB after optimization is reduced by about 19 ℃ compared with the initial layout, down to 83.3% of the initial layout.