A Hybrid Multi-objective Genetic Algorithm Combined with Dispatching Rule for Wafer Test Scheduling

Wafer test, also known as wafer probe or wafer sort, is a critical process that ensures the quality of dies after the wafer has been fabricated. Wafer testing process involves multiple components, including tester, prober, load board (LB), and probe card (PC), and solving the wafer test scheduling problem (WTSP) can be challenging due to its complexity. Traditional algorithms often struggle with large-scale problems in this domain. To address this issue, this paper aims to propose a hybrid multi-objective generic algorithm combined with a dispatching rule to solve WTSP. In this paper we compared our algorithm with dispatching rules and non-dominated sorting genetic algorithm (NSGAII) combined with variable neighborhood descent algorithm (VND) in terms of minimizing tardy jobs and reducing the changeover of PC and LB. The results demonstrate that our algorithm is capable of effectively solving large-scale scheduling problems.