One Factor at a Time Investigation of Injection Molding Process for Thin-Walled Laptop Component via Simulation

This study aims to determine the optimal processing parameters for the injection molding process used to produce plastic laptop bottom cases. Thin-walled parts, such as laptop components, can be difficult to produce due to warpage and shrinkage defects. Proper selection of process parameters is essential to achieving high-quality, functional parts. The researchers used Moldflow simulation software to conduct one factor at a time (OFAT) investigations of mold temperature, fill time, fill pressure, and melt temperature to determine their effects on warpage and shrinkage. SolidWorks software was used for part modeling. The study found that injection time significantly impacts warpage, shrinkage, and short shot defects. Mold temperature should be at or below 75 °C to control warpage, while melt temperature should be between 255 and 260 °C to prevent short shot defects and control warpage. Higher injection pressure can reduce warpage, but it can cause longer freezing times, which can be addressed by changing gate location and cooling channel design. Increasing injection time can decrease warpage, but times over 1.2 s may cause short shot defects. These findings can be useful for improving the quality of thin-walled plastic parts and reducing manufacturing costs.