Structural Analysis of Contact System of High-Voltage DC Relay Under Electrical-Thermal-Structural Coupling

Contact system is the main mechanism of high-voltage DC relay. Therefore, it is of great significance to analyze the contact system under the electrical-thermal-structural coupling for the study of relay reliability. ANSYS software is used to analyze the electrical thermal structural coupling of the contact system of high-voltage DC relay. Firstly, the electrical-thermal coupling simulation model is established. The influence of load current and ambient temperature on the steady-state temperature field of contact system is analyzed. Then, taking the temperature load as the input, the multi field coupling simulation of the contact system of high-voltage DC relay is carried out. Study the influence of current load and ambient temperature on the mechanical structure of contact system. The maximum total deformation of the moving spring increased by 0.085 mm. When the load current increases from 100A to 500A.The maximum total deformation of the moving spring increased by 0.029 mm. When the ambient temperature changes from −40 \(^\circ{\rm C} \) to 40 \(^\circ{\rm C} \) . It can be proved that the load current and ambient temperature have an important impact on the component structure.