Analytical Study on Stress Reduction in Single Patch Plate Bonded Joints Under Bending Force by Patch Plate End Design Optimization
摘要
Adhesive debonding from the end of patch plates is one of the major concerns in the application of externally bonded joint methods for repairing or strengthening steel structures. This paper focuses on stress reduction of adhesively bonded joints by investigating different patch plate end configurations, such as fillet or reverse taper ends. The target specimen model was the adhesively bonded joints of the single patch plate adhered to the base plate subjected to the bending force. The epoxy resin Konishi E258R was used as the adhesive in this study. Four different patch plate end types of specimen models were analytically investigated. The FE analysis was conducted by modeling using MSC Marc/Mentat 2022. The results indicate a significant decrease in stress at the tapered end of the adhesively bonded joint for each design of the patch plate end.