Miniaturization of electric components aces the performance by rapidly increasing transistors on microchips with increased power and, consequently, higher heat fluxes. The discrepancy lies in the fact that increasing heat flux would lead to an exponential rise in temperature by generating thermal increase or heating issues proving to be a significant disadvantage in miniaturization. To reduce the effect of overheating, thermal management on a miniature scale is an essential measure. An initiative to contribute to the potential storage is deliberated throughout the paper. Three-dimensional modeling of the micro-channel heat sink with microfins incorporated has been simulated and explored. The microchannel heat sink with microfins having two different orientation cases is examined. The rectangular microfins of the same cross-sectional area are taken but vary the orientation along the flow. The microfins arrangement with length by width (l/b) 0.5 is taken as Case 1, and the l/b ratio of 2 is named Case 2. The thermal performance of the Case 1 is much better than Case 2, with enhancement in heat transfer by four times. The pressure drop penalty was higher in Case 1, but the augmentation in thermal performance was much more prominent.