In this study, thermo-fluid behavior of a hybrid heat sink combining metal foam with perforated micro pin fins and solid fin is studied to enhance heat dissipation of high-power electronic devices. Three-dimensional numerical simulations considering steady, laminar, incompressible flow have been performed using commercial software Ansys Fluent. Local thermal non-equilibrium (LTNE) conditions following Forchheimer–Brinkman extended Darcy model is adopted in the simulations. The flow behavior is studied and observed for solid pin fin with/without porous matrix and perforated pin fin with porous matrix. It is found that flow behavior in perforated circular micro pin fins is very different from solid micro pin fin. The formation of vortices initially around the perforated fins enhancing local convective heat transfer and subsequently stabilizing the flow for efficient heat dissipation whereas the solid heat sink with porous matrix doesn’t have any vortex formation. In contrast, solid heat sink without porous matrix exhibits large and persistent vortex formation around pin fin. The heat sink combining metal foam with perforated micro pin fins shows higher heat dissipation rate via fins and perforations due to the greater heat transfer surface area between the solid wall interface and fluid wall interface. The results indicated that perforations in the pin fin combined with the porous matrix, significantly contributed in enhancing heat dissipation while also lowering the pressure drop.