Micro features on borosilicate glass necessitates its applications in micro domain for wireless transmission systems. Due to constraints of contemporary methods, ECDM is emerging as a feasible alternative for glass micro drilling. However, inadequate electrolyte coupled with feeble flushing in the processing zone deteriorates the surface smoothness of micro drilled glass vias (required for the packaging of RF-MEMS), resulting in the deterioration of transmission signal in high frequency wireless networks. Therefore, the current study provides the solution with Temperature cum Stirring assisted ECDM that utilizes a magnetic stirrer to improve the smoothness (i.e., to reduce the surface roughness) of machined micro holes. The response outcomes from this study shows that the synergy between electrolyte stirring and temperature plays a significant role in achieving good surface finish of micro holes, meant for glass vias. Thus, enhancing the industrial feasibility of the process.

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On Enhancing the Microhole Quality in Glass Vias to Enhance the Applicability for μ-electromechanical Systems

  • Dil Bahar,
  • Akshay Dvivedi,
  • Pradeep Kumar

摘要

Micro features on borosilicate glass necessitates its applications in micro domain for wireless transmission systems. Due to constraints of contemporary methods, ECDM is emerging as a feasible alternative for glass micro drilling. However, inadequate electrolyte coupled with feeble flushing in the processing zone deteriorates the surface smoothness of micro drilled glass vias (required for the packaging of RF-MEMS), resulting in the deterioration of transmission signal in high frequency wireless networks. Therefore, the current study provides the solution with Temperature cum Stirring assisted ECDM that utilizes a magnetic stirrer to improve the smoothness (i.e., to reduce the surface roughness) of machined micro holes. The response outcomes from this study shows that the synergy between electrolyte stirring and temperature plays a significant role in achieving good surface finish of micro holes, meant for glass vias. Thus, enhancing the industrial feasibility of the process.