During the recent times, growth of the manufacturing sector and developments in terms of fourth industrial revolution necessitate additive manufacturing (AM) as key technology. AM technologies enable the production of highly customized and complex geometries in various applications in diversified sectors. For the development of varied size electronic parts, traditional manufacturing techniques require some specific moulds and tool, etc., which contribute to significant time and cost to produce the parts. DfAM methods enable the manufacture of components with lesser weight, low material utilization and lesser printing time. DfAM methods such as topology optimization, lattice structure generation, direct assembly, build orientation and support reduction are focussed for reduced printing time, raw material utilization and generate lightweight components with high strength and stiffness in the development of electronic components. DfAM methods are analysed using MCDM tool Grey-TOPSIS. The priority order of DfAM methods is being derived.

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Analysis of Design for Additive Manufacturing Methods for Electronic Products Manufacture

  • S. Kumaradevan,
  • S. Vinodh,
  • S. S. Karthikeyan

摘要

During the recent times, growth of the manufacturing sector and developments in terms of fourth industrial revolution necessitate additive manufacturing (AM) as key technology. AM technologies enable the production of highly customized and complex geometries in various applications in diversified sectors. For the development of varied size electronic parts, traditional manufacturing techniques require some specific moulds and tool, etc., which contribute to significant time and cost to produce the parts. DfAM methods enable the manufacture of components with lesser weight, low material utilization and lesser printing time. DfAM methods such as topology optimization, lattice structure generation, direct assembly, build orientation and support reduction are focussed for reduced printing time, raw material utilization and generate lightweight components with high strength and stiffness in the development of electronic components. DfAM methods are analysed using MCDM tool Grey-TOPSIS. The priority order of DfAM methods is being derived.