Realizing the micro-devices is a challenging task to the practical engineers involved in this specialized field. Not only the design and device fabrication play an important role in this holistic activity, but also packaging or post-fabrication activity is considered as one of the key process for getting success in this domain. As compared to standard micro-fabrication or CMOS process, MEMS technology differs entirely because of its several unique features, engaged at the every process steps of its realization starting from scratch to the end product. This particular chapter highlights such three important critical aspects of micro-device realization. Those are: wafer bonding, packaging aspects in terms of HMC and bond wire effect. Critically every section has been touched upon here with practical/experimental results obtained by the authors group.