This Chapter outlines the development of a microheater structure on silicon as well as glass substrates. The structure is a planar type and miniaturized form. Standard CMOS-fabrication steps have been implemented to realize it. This Chapter details about the practical considerations, bottlenecks, and ways to mitigate it. Electrical characterization is also briefed herewith-detailed data analysis. Further, novel-packaging techniques are summarized here keeping in view of all practical constraints.